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    典型案例/Case

    某半導體行業廢水處理工程

    Semiconductor wastewater treatment project of a wafer manufactory


      該企業車間產生廢水大致可分為一般酸洗廢水、切割研磨廢水、電鍍含銅廢水和其他濃液,其中濃液的水量較小,可由桶槽獨立收集后委外處理。 本工程針對一般酸洗廢水、切割研磨廢水和電鍍含銅廢水進行設計處理。 
    In this wafer manufactory, the semiconductor wastewater was composed of acid cleaning wastewater, abrasion wastewater, Cu wastewater and other concentrated wastewater. According to the low amount, the concentrated wastewater could be collected by different buckets and outsourced treated. The design of this project’s mainly for the treatment of acid cleaning wastewater, abrasion wastewater, and Cu wastewater.

    廢水名稱
    Wastewater types

    一般酸洗廢水
    Acid cleaning wastewater

    切割研磨廢水
    Abrasion wastewater

    電鍍含銅廢水
    Cu wastewater

    水量(m3/d)
    Discharge

    800

    640

    72

    廢水排放標準
    Emissions Standards

    《污水綜合排放標準》GB8978-1996中三級標準
    < Integrated wastewater discharge Standard > the third standard

    電鍍污染物排放標準》GB21900-2008中表三要求
    < Emission standard of pollutants for electroplating > Schedule III


    流程圖 Flow-process Diagram

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